TPIs powders can be either amorphous or semi-crystalline thermoplastics. In general, TPI powders can be used for compounding, compression molding, and other powder-based processing techniques. The parts and components produced from TPI powders possess high rigidity, excellent creep resistance and low thermal expansion. In addition, TPI parts have high electrical breakdown strength and excellent radiation resistance.
TPI is mainly used in aerospace, as well as in the electrical industry. TPI's applications include wire and cable insulation, high performance connectors and accessories, on-road and off-highway gearing washers and gaskets, semiconductor plasma chamber components and containment systems, jet engine components, high temperature films, bearing cages, gears, diaphragms, stickshapes, and composites.
BIEGLO is the distributor of Mitsui Chemicals AURUM® PD450 TPI powders.
The advantages of AURUM® are the extremely high glass transition temperature (Tg) of 245°C and its outstanding mechanical and chemical properties across a wide range of temperatures. Compounders and other converter that are able to melt-process polymers at elevated temperatures can use AURUM® to produce parts with superior thermal and mechanical properties. Typical applications are high-performance washers, ball-bearing cages, dry bearings, seals and gears - where excellent mechanical & tribological properties and temperature resistance are paramount. In addition, AURUM® is usable for advanced coatings, and clean applications such as semiconductors due to trace amounts of outgas and metallic impurities. Used in aviation, automotive and other industries, AURUM® can be compounded and converted like any other thermoplastic.
To complete the TPI range, BIEGLO also offers a low temperature grade TPI powder, amorphous and semi-crystalline, for variety of applications under its own “Dexnyl” brand:
• DexnylTM 185 TPI Powder
DexnylTM 185 TPI is a semi-crystalline TPI with glass transition temperature of 185 °C. It has very low water absorption that gives it a high level of dimensional stability. This material has mechanical properties quite similar to PEEK at room temperature and higher than PEEK above 130 °C. It is suitable for compression molding and compounding and is priced moderately between PEEK and other TPI.